PART |
Description |
Maker |
21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
|
Maxim Integrated Products, Inc. MAXIM - Dallas Semiconductor
|
G3VM-51PR |
Smallest Class in market, USOP Package MOS FET Relays is designed to exhibit a fast rise time and reduce signal degradation.
|
Omron Electronics LLC
|
ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸(16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu... ICSI[Integrated Circuit Solution Inc] Intersil, Corp.
|
SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
AP2311GN-HF AP2311GN-HF-14 |
1.8 A, 60 V, 0.25 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp. Advanced Power Electronics ...
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
SSOP-16 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
HTSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP2X2-4 |
Package Outline
|
Global Mixed-mode Techn...
|
DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|